Title:
WAFER DIVIDING DEVICE
Document Type and Number:
Japanese Patent JP2015002289
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer dividing device capable of properly dividing a wafer by applying an external force to the wafer having a division origin provided therein.SOLUTION: A wafer dividing device includes: frame holding means (50) for holding an annular frame (19) to which a wafer (11) is stuck via a protective tape (21); an air ejection nozzle (20) having a nozzle body (42) and an air ejection groove (46) formed on an upper face (42a) of the nozzle body, the ejection groove being positioned parallel to a division scheduled line (13) and compressed air in a line form being ejected to the protective tape side of the wafer to divide the wafer by a division origin (17) formed along the division scheduled line; and moving means (30) for moving the frame holding means and the air ejection nozzle relatively to each other.
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Inventors:
OTAKE YUSUKE
UCHIDA FUMIO
KOZAI HIROHIKO
UCHIDA FUMIO
KOZAI HIROHIKO
Application Number:
JP2013126780A
Publication Date:
January 05, 2015
Filing Date:
June 17, 2013
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301
Domestic Patent References:
| JP2013048133A | 2013-03-07 | |||
| JP2007055197A | 2007-03-08 | |||
| JP2004214262A | 2004-07-29 | |||
| JPH03169046A | 1991-07-22 |
Attorney, Agent or Firm:
Matsumoto 昂