Title:
WAFER-EQUALIZATION PROCESSING AFTER SAW-CUTTING OF DMDS (DIGITAL METHOD MICROMIRROR ELEMENT)
Document Type and Number:
Japanese Patent JPH07153823
Kind Code:
A
Abstract:
PURPOSE: To provide the protecting and fixing equipment and the manufacturing method of the fine mechanism element of a fragile structure manufacture on a wafer. CONSTITUTION: A fixing equipment 26 for protecting at least one fine structure element manufactured on a wafer 22 is prepared and this fixing equipment 26 is provided with at least one upper space 28 on an element for preventing contact with the element, a vacuum port 30 for exhausting connected to this space 28 and a surface with a worked for forming a closely sealed state by the equipment 26 and the wafer 22. In the state of mounting the wafer 22 to the equipment 26 by exhausting the space 28 to vacuum, such influence as breaks the fine mechanism element, the washing operation of a semiconductor chip, e.g. which gives such influence as breaks the fine mechanism element is executed and after completing the operation of them, the element is separated from the wafer 22 to realize the stable manufacture of the fine mechanism element.
Inventors:
RICHIYAADO OO GEIRU
MAIKURU EI MIGUNAADEI
MAIKURU EI MIGUNAADEI
Application Number:
JP14187194A
Publication Date:
June 16, 1995
Filing Date:
June 23, 1994
Export Citation:
Assignee:
TEXAS INSTRUMENTS INC
International Classes:
G02B26/02; B25B11/00; B28D5/00; B28D5/02; B81C1/00; G02B26/08; H01L21/301; H01L21/683; (IPC1-7): H01L21/68; H01L21/301
Attorney, Agent or Firm:
Akira Asamura (3 outside)