Title:
ウェーハ貼付装置
Document Type and Number:
Japanese Patent JP3986853
Kind Code:
B2
Inventors:
Yusaku Shigeyama
Hoshino Sadao
Takeshi Maeda
Sawada Gojin
Murakami Katsuyoshi
Hoshino Sadao
Takeshi Maeda
Sawada Gojin
Murakami Katsuyoshi
Application Number:
JP2002070408A
Publication Date:
October 03, 2007
Filing Date:
March 14, 2002
Export Citation:
Assignee:
Mitsubishi Materials Techno Co., Ltd.
Sumco inc.
Sumco inc.
International Classes:
B24B37/30; B24B41/06; H01L21/304; H01L21/68; H01L21/683
Domestic Patent References:
| JP11156710A | ||||
| JP11245163A | ||||
| JP9136259A | ||||
| JP2001219368A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama
Tadashi Takahashi
Masakazu Aoyama
Yasuhiko Murayama