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Title:
WAFER POLISHING DEVICE WITH DRESSER AND DRESSING METHOD FOR ABRASIVE FABRIC SURFACE
Document Type and Number:
Japanese Patent JPH04343658
Kind Code:
A
Abstract:

PURPOSE: To improve the polishing precision and improve the polishing work efficiency by providing a dresser with a correcting ring correcting a polishing fabric on the outer periphery of a top ring.

CONSTITUTION: A dresser 15 is freely rotated independently from the rotation of a top ring when a turntable is rotated for polishing, a correcting ring 17 is brought into contact with an abrasive fabric, thus the roughness on the surface of the abrasive fabric can be corrected concurrently with the polishing of a wafer. The correcting ring 17 is located on the outer periphery of the top ring, and the whole surface of the abrasive fabric can be set to the uniform state along the peripheral direction of the turntable in a circle slightly larger than the polishing region of the wafer. The abrasive fabric is corrected on the surface when it enters the correcting ring 17, it is brought into contact with the wafer after being corrected, thus the polishing precision can be sharply improved.


Inventors:
INADA YASUO
Application Number:
JP13858791A
Publication Date:
November 30, 1992
Filing Date:
May 15, 1991
Export Citation:
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Assignee:
FUJIKOSHI KIKAI KOGYO KK
International Classes:
B24B37/005; B24B37/30; B24B53/007; B24B53/017; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; H01L21/304
Attorney, Agent or Firm:
Akimoto Teruo