Title:
WAFER POLISHING HEAD, WAFER POLISHING DEVICE, AND MANUFACTURE OF WAFER
Document Type and Number:
Japanese Patent JP3623383
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To enhance the uniformity in polishing of a wafer surface by preventing a polishing pad from undulate deformation.
SOLUTION: A wafer polishing head H is equipped with a head body 1 consisting of a top plate 1a and circumferential wall 1b, a diaphragm 2 installed stretching inside the head body 1, a carrier 3 to displace a wafer W in association with deformation of the diaphragm 2, a retaier ring 4 fixed to the udersurface of the diaphragm 2 and arranged displaceably in compliance with the deformation of the diaphragm, and a pressure adjusting mechanism 5 to deform the diaphragm 2 in the head axial direction L, wherein between the head body 1 and diaphragm 2, a spacer is removably interposed in such a way as constituting a flange. This reduces the pressure acting on a polishing pad P through the retainer ring and prevents the polishing pad P from undulate deformation.
Inventors:
Kazuko Hosoki
Hiroshi Shibatani
Masato Komazaki
Jiro Sano
Hiroshi Shibatani
Masato Komazaki
Jiro Sano
Application Number:
JP2938999A
Publication Date:
February 23, 2005
Filing Date:
February 05, 1999
Export Citation:
Assignee:
Ebara Corporation
International Classes:
B24B37/005; B24B37/04; B24B37/30; B24B37/32; H01L21/304; (IPC1-7): B24B37/00; B24B37/04; H01L21/304
Domestic Patent References:
| JP8229804A |
Attorney, Agent or Firm:
Masakazu Aoyama
Tetsuo Yamazaki
Masatake Shiga
Tetsuo Yamazaki
Masatake Shiga