PURPOSE: To provide a wafer processing apparatus having an electrostatic chuck which dispenses with a preliminary discharge prior to and after wafer processing, or to provide a wafer processing apparatus which can bring, without fail, a temperature measuring means to measure the wafer temperature in contact with a wafer.

CONSTITUTION: A wafer processing apparatus of the first mode comprises (a) an electrostatic chuck 30 complete with an electrode 32 to fix a wafer 50 by electrostatic force, (b) a support table 12 loaded with an electrostatic chuck, and (c) a pusher 36 which is earthed and with which to raise the wafer 50 to the electrostatic chuck 30 or lower it. A wafer processing apparatus of the second mode comprises (a) a temperature measuring means 60 to measure the temperature of the wafer 50 and (b) an energizing means 62 to energize the temperature measuring means 60 to the wafer.