Title:
WAFER PROCESSING DEVICE
Document Type and Number:
Japanese Patent JPH0936207
Kind Code:
A
Abstract:
To provide a wafer processing device that a wafer is not charged with electricity at the time of heat treatment and at the time of transfer between the process parts.
Conductive polyimide resin containing carbon is used as a wafer placing claw 22 and a lifter cap 5, and conductive ceramic is used as a ball 6 for a proximity gap. Thus, as a wafer is not charged at the time of heat treatment and at the time of carrying between the process parts, a spark occurs when the wafer is heated and the wafer is transferred between the heat treatment part and wafer transferring means, and fine particles such as dust, etc., cannot be attracted when the wafer is heated and transferred between the process parts.
Inventors:
MATSUSHITA MASANAO
SASADA SHIGERU
FUKUTOMI YOSHIMITSU
SASADA SHIGERU
FUKUTOMI YOSHIMITSU
Application Number:
JP18181495A
Publication Date:
February 07, 1997
Filing Date:
July 18, 1995
Export Citation:
Assignee:
DAINIPPON SCREEN MFG
International Classes:
B65G49/07; H01L21/027; H01L21/677; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; B65G49/07; H01L21/027
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)