Title:
ウエーハの加工方法及び粘着テープ
Document Type and Number:
Japanese Patent JP6831248
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer processing method and an adhesive tape which do not damage quality by debris adhered on side surfaces of individual chips divided by irradiation of laser beam when irradiating the laser beam and working the wafer.SOLUTION: A processing method which irradiates laser beam LB of wavelength having absorptivity with respect to a wafer 10 and divides it into individual chips is composed at least of: an adhesive tape sticking step in which to stick the wafer to an adhesive tape T generating gases G by irradiation of the laser beam; a holding step in which to hold the adhesive tape side onto a chuck table and to expose the wafer; a division step in which to divide the wafer while relatively moving the chuck table and the laser beam; and a quality working step in which to apply to a side surface 101 of the chips divided by the gases generated by irradiation of the laser beam reaching the adhesive tape work that prevents damage the quality when performing the division step.SELECTED DRAWING: Figure 3
Inventors:
Kazuma Sekiya
Application Number:
JP2017004825A
Publication Date:
February 17, 2021
Filing Date:
January 16, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/364
Domestic Patent References:
| JP2004186200A | ||||
| JP2005523583A | ||||
| JP2000277487A |
Foreign References:
| US20020006765 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko
Sachiko Okunuki
Kojino Koji
Yoshifumi Kaneko