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Title:
表面に凹凸を有するウエハの処理方法
Document Type and Number:
Japanese Patent JP6475504
Kind Code:
B2
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JP6297452Substrate processing equipment, substrate processing method, and storage medium
Inventors:
Hirohide Yabuguchi
Takahiro Aso
Application Number:
JP2015023388A
Publication Date:
February 27, 2019
Filing Date:
February 09, 2015
Export Citation:
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Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01L21/304; C09J7/00; H01L21/683
Domestic Patent References:
JP2008115272A
JP2005048039A
JP10050642A
JP2011054827A
JP2014067982A
Attorney, Agent or Firm:
Atomi International Patent Office



 
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