Title:
ウェーハの加工方法
Document Type and Number:
Japanese Patent JP7334012
Kind Code:
B2
Abstract:
To form a device chip without deteriorating quality.SOLUTION: A wafer processing method for dividing a wafer in which a plurality of devices are formed on a surface into individual device chips comprises a polyolefin-based sheet arranging step, an integrating step, a frame supporting step, a dividing step, and a picking-up step. The polyolefin-based sheet arranging step arranges a polyolefin-based sheet on a rear surface or a surface of the wafer. The integrating step heats and presses the polyolefin-based sheet, and integrates the wafer and the sheet. The frame supporting step supports the polyolefin-based sheet by a frame composed of a first frame including an opening and a plurality of magnets and a second frame including an opening by holding an outer periphery of the polyolefin-based sheet by a magnetic force using the frame. The dividing step forms a shield tunnel in the wafer by irradiating the wafer with a laser beam of a wavelength having permeability to the wafer and divides the wafer into individual device chips. The picking-up step picks up the individual device chips.SELECTED DRAWING: Figure 4
Inventors:
Shigenori Harada
Minoru Matsuzawa
Itsuto Kiuchi
Yoshiaki Yodo
Taro Arakawa
Masamitsu Kamisato
Keimiko Kawamura
Yusuke Fujii
Toshiki Miyai
Omae scroll
Minoru Matsuzawa
Itsuto Kiuchi
Yoshiaki Yodo
Taro Arakawa
Masamitsu Kamisato
Keimiko Kawamura
Yusuke Fujii
Toshiki Miyai
Omae scroll
Application Number:
JP2019145068A
Publication Date:
August 28, 2023
Filing Date:
August 07, 2019
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B23K26/53
Domestic Patent References:
| JP2005191297A | ||||
| JP2009266909A | ||||
| JP2003100727A | ||||
| JP2017147361A | ||||
| JP2002060537A | ||||
| JP10112494A | ||||
| JP49037564A | ||||
| JP2054564A |
Foreign References:
| WO2016151911A1 | ||||
| WO2013021644A1 |
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano