PURPOSE: To prevent the temperature change of a wafer without generating vibration in a wafer, and improve position precision, by making a temperature adjusting part and a wafer sucking part independent, and making vibration hard to propagate.

CONSTITUTION: A heat dissipating fin 117 installed on a wafer chuck 107 and a heat absorbing fin 114 installed on a temperature adjusting part 306 are arranged so as to have a fine gap 304. A plurality of air intake vents 301 are formed on the wafer sucking surface side of a chuck 107. Each of the intake vents 301 is connected with a vacuum pump via suction piping 302 buried in the chuck 107, thereby retaining the wafer 109 on the suction surface of the chuck 107. By circulating liquid kept at a constant temperature via piping 303 for temperature adjustment, the temperature of an adjustment part 306 can be kept constant.