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Title:
WALL THICKNESS MEASURING DEVICE AND METHOD OF HIGH-TEMPERATURE TANK
Document Type and Number:
Japanese Patent JP2005265456
Kind Code:
A
Abstract:

To provide a wall thickness measuring device and a method of a high-temperature tank capable of measuring the wall thickness (namely, thickness reduction) in a wide range of the high-temperature tank in a short time without peeling an insulating material of the high-temperature tank (oven), and measuring accurately the actual wall thickness (namely, the thickness reduction) excluding an alloy layer even when the hard alloy layer is formed on the inner surface of the high-temperature tank and the apparent wall thickness is increased.

This device is equipped with a high-temperature ultrasonic sensor for emitting an ultrasonic wave at a higher temperature than high-temperature liquid and capable of detecting its reflected wave, a sensor holding fixture for dipping directly the high-temperature ultrasonic sensor into the high-temperature liquid and holding its test surface toward the wall inner surface of a part to be measured, and a waveform analysis device for analyzing the waveform of the reflected wave detected by the high-temperature ultrasonic sensor and calculating the wall thickness.


Inventors:
KAKITA HIDEKI
SASAHARA TOSHIHIKO
KAGEYAMA MORIO
FURUKAWA KIKUO
Application Number:
JP2004074657A
Publication Date:
September 29, 2005
Filing Date:
March 16, 2004
Export Citation:
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Assignee:
ISHIKAWAJIMA INSPECTION & INST
International Classes:
G01B17/02; G01N29/00; (IPC1-7): G01B17/02; G01N29/18
Attorney, Agent or Firm:
Minoru Hotta