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Patent Searching and Data


Title:
WATER-BASE EPOXY RESIN DISPERSION
Document Type and Number:
Japanese Patent JPH07309954
Kind Code:
A
Abstract:

PURPOSE: To obtain a water-base epoxy resin dispersion which is excellent in stability and gives a water-resistant coating film when used in combination with a curative such as a polyamideamine.

CONSTITUTION: The resin dispersion comprises a bisphenol epoxy resin pref. having an epoxy equivalent of 150-3,000, an epoxy resin of the formula [wherein R1 is a 2-10C linear, branched, or cyclic dicarboxylic acid residue; and R2 is C6H4C(R3)2C6H4 (wherein R3 is H or CH3)] having a mol.wt. of 1,500-50,000, water, and an org. solvent.


Inventors:
SHIBAHARA NAOKI
SAKANO MITSUHIRO
IHATA SHINZO
Application Number:
JP10264694A
Publication Date:
November 28, 1995
Filing Date:
May 17, 1994
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08J3/07; C08G59/14; (IPC1-7): C08J3/07; C08G59/14
Attorney, Agent or Firm:
Takahashi victory