Title:
WATER COOLING CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2017139462
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a water cooling circuit board which achieves good mass productivity and low costs and causes no problems of coolant leakage, and to provide a manufacturing method of the water cooling circuit board.SOLUTION: A water cooling circuit board 1 comprises: a metal block 10; an insulation layer 20 on a surface of the metal block 10; a conductor pattern 30 formed on the insulation layer 20 and used to mount an LED light source thereon. The metal block 10 made by casting has a through passage 11 through which a coolant passes.SELECTED DRAWING: Figure 1
Inventors:
YATANI HIROSHI
Application Number:
JP2017016561A
Publication Date:
August 10, 2017
Filing Date:
February 01, 2017
Export Citation:
Assignee:
ARROW SANGYO KK
International Classes:
H01L23/36; B22D19/00; C09J11/04; C09J163/00; H01L23/40; H01L23/473; H01L33/64; H05K1/02
Attorney, Agent or Firm:
Yasuhiro Nakanishi