Title:
WATER SOLUBLE SOLDERING FLUX
Document Type and Number:
Japanese Patent JP2516286
Kind Code:
B2
Abstract:
PURPOSE: To maintain tackiness to a degree needed for holding precisely aligned components during solder reflow by blending a tacky, nontoxic water soluble polymer as a carrier, an organic activating agent and water in specified ratios.
CONSTITUTION: A water soluble soldering flux compsn. is prepd. by incorporating about 4 to 40 wt.% tacky, nontoxic water soluble polymer as the carrier, an organic activator of a type to be brought into reaction with 2-8 wt.% oxides present on the surface to be fluxed, and the balance water. The preferable carrier is filtered natural resins and gum arabic. As the organic activating agent, citric acid, adipic acid or the like is used. The compsn. is effective for removing oxides present on the surface to be fluxed. The organic activating agent has a short life and is dissipated when being heated.
Inventors:
BAABARA RARISA GUTEIERETSUTSU
JANETSUTO SHITSUKURAA
JANETSUTO SHITSUKURAA
Application Number:
JP10342691A
Publication Date:
July 24, 1996
Filing Date:
April 09, 1991
Export Citation:
Assignee:
INTAANASHONARU BIJINESU MASHIINZU CORP
International Classes:
B23K35/363; B23K35/36; H05K3/34; (IPC1-7): B23K35/363; H05K3/34
Domestic Patent References:
| JP4913631A |
Other References:
竹本正・藤内伸一監訳「ソルダリングインエレクトロニクス」（昭和６１年８月３０日）、日刊工業新聞社、第１５９−１８０頁参照
Attorney, Agent or Firm:
Chika Takagi (2 outside)