Title:
WELDING HEAD
Document Type and Number:
Japanese Patent JP3700495
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a welding head capable of reducing the surface unevenness of a loading object of a circuit board and a prepreg to integrally bond the loading object.
SOLUTION: Recessed parts 5 are formed to the pressing surfaces 4 of welding heads A for partially heating and pressing a loading object 3 wherein a prepreg 2 is held between circuit boards 1 to integrally bond the loading object 3 by the molten resin of the prepreg 2. When the loading object is heated and pressed by the welding heads A, a part of the molten resin of the prepreg enters the recessed parts 5 of the pressing surfaces 4 to reduce the amount of the resin extruded to both sides of the welding heads A to reduce such a phenomenon that the resin is built up on both sides of the welding heads A to generate unevenness on the surface of the loading object 3.
Inventors:
Junichi Hoashi
Application Number:
JP30338599A
Publication Date:
September 28, 2005
Filing Date:
October 26, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B29C43/20; B29C43/34; B29C65/02; H05K3/46; B29K105/06; B29L31/34; (IPC1-7): B29C43/20; B29C65/02; H05K3/46
Domestic Patent References:
| JP10224032A | ||||
| JP6079785A | ||||
| JP2000106486A |
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori
Atsuo Mori