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Title:
WET SPRAYED COATINGS FOR INTERCONNECTS FOR SOEC AND SOFC
Document Type and Number:
Japanese Patent JP2022112504
Kind Code:
A
Abstract:
To provide a coating method of an interconnect for avoiding deterioration of a SOFC stack generated in relation to chromia formation of components of a metal interconnect.SOLUTION: There are provided systems, devices, and methods that utilize a method of coating an interconnect for a SOEC or SOFC. The method includes wet spraying a coating precursor powder onto an interconnect, and sintering the interconnect in an oxidizing ambient to form the coating.SELECTED DRAWING: Figure 3

Inventors:
TAD ARMSTRONG
SANCHIT KHURANA
LU ZIGUI
Application Number:
JP2022006997A
Publication Date:
August 02, 2022
Filing Date:
January 20, 2022
Export Citation:
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Assignee:
BLOOM ENERGY CORP
International Classes:
C25B1/042; C25B9/00; C25B9/23; C25B13/04; C25B13/07; H01M8/0206; H01M8/021; H01M8/0215; H01M8/0228; H01M8/12
Attorney, Agent or Firm:
Patent Attorney Corporation Peace International Patent Office