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Title:
WIPING ROLLER MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2008155084
Kind Code:
A
Abstract:

To provide a wiping roller molding apparatus which enables the full automation of wiping roller molding steps and provides a wiping roller substrate having uniform product quality.

In the wiping roller molding apparatus to support the wiping roller substrate so that it can rotate and to apply and print a resin material to the wiping roller substrate, it consists of an operation mechanism which inputs and displays various conditions necessary for forming the wiping roller, a material control mechanism which stores and incorporates a resin material to coat the wiping roller substrate, a doctor knife mechanism for forming the thin film resin layer, a printing mechanism, a cooling mechanism and a control mechanism which indicates to start the coating by detecting that the necessary amount of the resin material has been incorporated, which indicates to start the printing by detecting that the resin material has been applied on the wiping roller substrate to a desired film thickness, and to start the cooling by detecting that the hardness of the resin material coated to the wiping roller by the printing has been reached to a predetermined hardness.


Inventors:
HATTA TAKUYA
SUGIYAMA HIROYUKI
Application Number:
JP2006344144A
Publication Date:
July 10, 2008
Filing Date:
December 21, 2006
Export Citation:
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Assignee:
NAT PRINTING BUREAU
International Classes:
B05C11/04; B05C9/14; B05C11/00; B41F9/08
Domestic Patent References:
JPS5121903A1976-02-21
JP2001080032A2001-03-27
JPH115056A1999-01-12
JP2003220355A2003-08-05
JP2000132240A2000-05-12
JP2006049630A2006-02-16
JPH02148683A1990-06-07
JPH0295470A1990-04-06
JP2001176897A2001-06-29