Title:
ワイヤ・ボンディング・キャピラリ装置及び方法
Document Type and Number:
Japanese Patent JP2008543115
Kind Code:
A
Abstract:
A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.
Inventors:
Lange, Bernard, Pea.
Kumar, Steven, Alfred
Kumar, Steven, Alfred
Application Number:
JP2008515980A
Publication Date:
November 27, 2008
Filing Date:
June 09, 2006
Export Citation:
Assignee:
Texas Instruments Incorporated
International Classes:
H01L21/60
Attorney, Agent or Firm:
Hideto Asamura
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu
Hajime Asamura
Hayashi Zouzo
Kuniaki Shimizu