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Title:
WIRE BOND APPARATUS, WIRE BOND INSPECTION METHOD, AND WIRE BOND CORRECTION METHOD
Document Type and Number:
Japanese Patent JP2005236234
Kind Code:
A
Abstract:

To obtain stably and efficiently a wire bond of good quality by correcting a posture of a capillary so that the capillary contacts with a bonding surface vertically.

An angle detecting means 2 irradiates a bonding portion with light, images its image of reflected light by a CCD(computer-controlled display) camera 24, and detects the shape of a strike mark of the capillary by a control circuit 26 based on the imaged information. Then, based on the detected strike-mark of the capillary, an inclined angle θ between an imaginary surface vertical to the capillary and the bonding surface is detected. According to the result of the angle detection, in a body portion 3, the posture of the capillary 31 is corrected so that the capillary 31 always contacts with the bonding surface in a vertical direction.


Inventors:
NOZAKI KENZO
Application Number:
JP2004047103A
Publication Date:
September 02, 2005
Filing Date:
February 23, 2004
Export Citation:
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Assignee:
SHARP KK
International Classes:
H01L21/607; H01L21/60; (IPC1-7): H01L21/607; H01L21/60
Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Takeshi Oshio