Title:
WIRE BONDER
Document Type and Number:
Japanese Patent JPS5271982
Kind Code:
A
Abstract:
PURPOSE:To eliminate inspection process by human operations and make possible the volume production of highly reliable semidonductor devices by providing a mechanism for checking the bond strength to a wire bonding device per se and checking automatically the bond strength in succession to bonding operation.
Inventors:
OGURA MASAHISA
YAMAUCHI YUKIO
YAMAUCHI YUKIO
Application Number:
JP14812575A
Publication Date:
June 15, 1977
Filing Date:
December 11, 1975
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K20/00; H01L21/60; H01L21/66; (IPC1-7): B23K19/00; H01L21/60; H01L21/66