To improve the quality of a semiconductor device.

A wire-bonding device is composed of a wire spool 11i where wire 3 is wound, a capillary 11a that is provided at a bonding head 11, a wire guide 11j that guides the running of the wire 3 between the wire spool 11i and the capillary 11a and at the same time changes the running direction of the wire 3 and has a radius of curvature R 20 mm or longer R, a wire clamper 11b that is a member for gripping the wire 3 for supplying or cutting the wire 3, a head body part 11e that is the body of the bonding head 11, and an X-Y table 11f for mounting the head body part 11e. By forming the radius of curvature R of the wire guide 11j to be 20 mm or longer, the amount of curling of the wire 3 which is supplied from the wire spool 11i to the capillary 11a can be suppressed.