Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WIRE POLISHING METHOD
Document Type and Number:
Japanese Patent JPH04240067
Kind Code:
A
Abstract:

PURPOSE: To prevent flaw from remaining to the subsequent wire stretching process and providing possibility for polishing the wire, long and extra-thin, with any desired surface roughness by rotating a cylinder containing a mixture of media and compound at a low speed, allowing the cylinder at the same time to reciprocate fore and aft, and polishing the wire inserted in the center of the cylinder.

CONSTITUTION: A wire 1 is inserted in a polygonal cylinder 2, and media 3 and compound 4 are mixed and put in this cylinder 2. The cylinder 2 is rotated at a low speed in the (a) direction to agitate the mixture of media 3 and compound 4. At the same time, the cylinder 2 is moved in (b) direction fore and aft to male polishing. Therein the media 3 and compound 4 may be selected any as desired according to the required roughness of the surface to be finished.


Inventors:
ATOBE YUTAKA
Application Number:
JP1372891A
Publication Date:
August 27, 1992
Filing Date:
January 12, 1991
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO ELECTRONIC COMPONENTS
International Classes:
B24B5/38; B24B31/03; (IPC1-7): B24B5/38; B24B31/03
Attorney, Agent or Firm:
Keinosuke Hayashi