Title:
線材の処理方法
Document Type and Number:
Japanese Patent JP7297623
Kind Code:
B2
Abstract:
To provide a method for treating a wire rod in which Nb oxide film can be removed without causing pitting-corrosion on the wire rod.SOLUTION: According to the embodiment, a method for treating a wire rod defining the surface of the wire rod and having a hollow part, and containing a matrix comprising a CuNi-based alloy, and a plurality of filaments inserted into the hollow part of the matrix and comprising Nb is provided. The treatment method of the embodiment comprises removing at least a portion of the matrix to expose at least a portion of the plurality of filaments to the surface of the wire rod and cleansing the filament exposed to the surface of the wire rod with an aqueous solution of oxalic acid or an aqueous solution of sodium hydroxide.SELECTED DRAWING: Figure 2
Inventors:
Yukako Murakami
Hirotoshi Murayama
Ikuo Uematsu
Hirotoshi Murayama
Ikuo Uematsu
Application Number:
JP2019172433A
Publication Date:
June 26, 2023
Filing Date:
September 24, 2019
Export Citation:
Assignee:
Toshiba Corporation
Toshiba Energy Systems & Solutions Corporation
Toshiba Energy Systems & Solutions Corporation
International Classes:
C23G3/02; B23K1/00; C23G1/10; C23G1/20; H01B13/00
Domestic Patent References:
| JP6196241A | ||||
| JP6150992A | ||||
| JP62130293A | ||||
| JP48029638A | ||||
| JP63035787A | ||||
| JP9078298A |
Attorney, Agent or Firm:
Patent Attorney Corporation Suzue Patent General Office