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Title:
WIRE ROD FOR VAPOR DEPOSITION AND METALLIZED FILM CAPACITOR FORMED USING THE SAME
Document Type and Number:
Japanese Patent JP2011208246
Kind Code:
A
Abstract:

To provide a highly reliable metallized film capacitor by providing a wire rod for vapor deposition that can suppress the generation of splash upon vapor deposition.

The wire rod 1 for vapor deposition includes a core material 2 that consists of an alloy of magnesium and aluminum, and an oxidized layer 3 that coats an outer peripheral surface of the core material 2, and consists of oxides of at least the magnesium and the aluminum, wherein the thickness of the oxidized layer 3 is 0.3 μm or less. As a result, the splash that occurs because the oxidized layer 3 does not melt but only the core material 2 evaporates in vapor deposition can be suppressed. The dielectric film of the metallized film capacitor formed using the core material 1 for vapor deposition receives no damage by the splash, thereby being highly reliable.


Inventors:
OCHI YUKIKAZU
KUBOTA HIROSHI
Application Number:
JP2010078450A
Publication Date:
October 20, 2011
Filing Date:
March 30, 2010
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
C23C14/24; H01G4/015; H01G4/18
Domestic Patent References:
JP2005191276A2005-07-14
JPH02137126A1990-05-25
JP2009206296A2009-09-10
Other References:
JPN6013056333; J.H.NORDLIEN et al: 'Morphology and Structure of Water Formed Oxide on Temary MgAl Alloys' Journal of the Electrochemical Society Vol.144, No.2, 1997, P.461-466
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii