Title:
WIRE SAW AND WORK CUTTING METHOD BY WIRE SAW
Document Type and Number:
Japanese Patent JP3810170
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting method in which the thickness of a wafer to be cut out becomes uniform as far as practicable when a work is cut by a wire saw.
SOLUTION: A work cutting method pressure-contacts a work, at a specified speed, against a wire which moves from a wire delivery side to a wire receiving side and, while feeding abrasive grain slurry to a pressure-contact part, cut out the work for production of wafers. In this case, the feed speed of the work is controlled according to the abrasive grain size of the abrasive slurry so as to offset a reduction in cutting tolerance due to a reduction in abrasive grain size which occurs during the cutting of the work by an increase in cutting tolerance due to a reduction in the feed speed of the work.
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Inventors:
Hiroshi Oishi
Application Number:
JP3131297A
Publication Date:
August 16, 2006
Filing Date:
January 29, 1997
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B27/06; B23D57/00; B28D5/00; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Domestic Patent References:
| JP7299728A | ||||
| JP62271668A | ||||
| JP6224961A | ||||
| JP752149A |
Attorney, Agent or Firm:
Mikio Yoshimiya
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