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Title:
WIRE SAW
Document Type and Number:
Japanese Patent JPH10138230
Kind Code:
A
Abstract:

To provide a wire saw which is capable of further improving cutting accuracy compared with a conventional wire saw.

This wire saw consists of a wire bobbin 12 for holding wire 11 and at least, two rollers 24 around which the wire 11 to be supplied from the wire bobbin 12 is wound. Rows 14 of wire are formed between the two rollers 24 and are fed in the longitudinal direction to cut a work to be fabricated through pressing the work against the rows 14 of wire while supplying a cutting liquid. In this case, a temperature control device 15 is mounted on the wire bobbin 12 to control the temperature of the wire 11 held in the wire bobbin 12 through the wire bobbin 12.


Inventors:
HARADA SEISHI
SUZUKI NARIKAZU
Application Number:
JP30860796A
Publication Date:
May 26, 1998
Filing Date:
November 06, 1996
Export Citation:
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Assignee:
TOSHIBA CERAMICS CO
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B28D5/04; B24B27/06
Attorney, Agent or Firm:
Toru Tanabe



 
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