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Patent Searching and Data


Title:
WIRE TYPE CUTTER DEVICE
Document Type and Number:
Japanese Patent JPH10193249
Kind Code:
A
Abstract:

To improve cutting accuracy by suppressing thermal deformation of a support frame.

This cutter device 10 is constituted such that a plurality of grooved rollers 12 provided with a wire 12b to extend mutually therebetween and a support frame 13 supporting a cut member 15 capable of approximating/ separating relating to the wire 12b in an upper position of these grooved rollers 12 are provided, in a condition running the wire 12b, while pressing the cut member 15 relating to the wire 12b, a machining fluid containing an abrasive grain is supplied, to perform cutting of the cut member 15. Here, in the support frame 13, a cooling pipe 20 is provided.


Inventors:
SAKAMOTO ATSUSHI
SUZUKI TATSUYUKI
Application Number:
JP172997A
Publication Date:
July 28, 1998
Filing Date:
January 08, 1997
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Attorney, Agent or Firm:
Masatake Shiga (2 outside)