WIRING BOARD, CIRCUIT BOARD, ELECTRO-OPTIC DEVICE AND METHOD FOR MANUFACTURING THE SAME, ELECTRONIC EQUIPMENT

Title:

WIRING BOARD, CIRCUIT BOARD, ELECTRO-OPTIC DEVICE AND METHOD FOR MANUFACTURING THE SAME, ELECTRONIC EQUIPMENT

Document Type and Number:

Japanese Patent JP2004145011

Kind Code:

A

Abstract:

To lower the resistance of power supply lines of a display device (electro-optic device) and to reduce the loss in supplying an electric current to light emitting elements etc.

The wiring board used for the electro-optic device configured to include electro-optic elements and driving circuits for driving the electro-optic elements includes power supply line films (32) for supplying the electric current for operating the electro-optic elements to the driving circuits, signal line films (20) for supplying the level signal for setting the magnitude of the electric current to be supplied to the electro-optic elements to the driving circuits and operating line films (30) for supplying an operation command signal for commanding whether the electro-optic elements are operated or not to the driving circuits. The wiring board is formed by laminating the films (32), the films (20) and the films (30) in such a manner that the films (32) among these films are formed as upper layers.

Inventors:

KIMURA MUTSUMI

Application Number:

JP2002310010A

Publication Date:

May 20, 2004

Filing Date:

October 24, 2002

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

H05B33/12; G09F9/30; H01L21/336; H01L27/32; H01L29/786; H01L51/50; H01L51/56; H05B33/26; (IPC1-7): G09F9/30; H01L21/336; H01L29/786; H05B33/12; H05B33/14; H05B33/26

Attorney, Agent or Firm:

Yoshiyuki Inaba
Katsuro Tanaka
Shinji Oga

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