Title:
WIRING BOARD, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING WIRING BOARD
Document Type and Number:
Japanese Patent JP2017126662
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring board capable of enhancing a degree of freedom of a position at which an external terminal is provided, and of applying a large current.SOLUTION: A wiring board includes: a substrate; a first insulating layer provided above the substrate; a first resin projection provided above the first insulating layer; first wiring being provided above the first insulating layer and separated from the first resin projection; a second insulating layer having an opening and being provided so as to cover the first wiring; and a first conductive layer extending from above the first resin projection and being connected to the first wiring via the opening. A material of the first wiring is copper or nickel. The first conductive layer includes a first metal layer, and a second metal layer being provided above the first metal layer and having a material being gold or palladium.SELECTED DRAWING: Figure 2
Inventors:
HANAOKA TERUNAO
SHINDO AKINORI
NEISHI YUZO
SHINDO AKINORI
NEISHI YUZO
Application Number:
JP2016005118A
Publication Date:
July 20, 2017
Filing Date:
January 14, 2016
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H05K1/02; B41J2/14; B41J2/16
Attorney, Agent or Firm:
Yukio Fuse
Mitsue Obuchi
Mitsue Obuchi