To provide a wiring board that can respond to micromachining and higher-density wiring and mass-production as well as has a favorable insulating characteristics between wires and favorable heat stability.

One or more original transfer plates provided with wiring comprising a conductive layer formed by plating in a certain side on a holding body are used to sequentially transfer the wiring of each original transfer plate on at least one surface of the substrate for a wiring board to provide a wiring board provided with wiring. Via an adhesive layer comprising an insulating resin layer 133 or a conductive resin layer, each wiring 120 is attached on the lower layer wiring formed directly or by transfer on the substrate 111 for the wiring board. As the adhesive layer comprising an insulating resin layer 133, an electrodeposition coating composition comprising a polyimide resin containing an ionic group, an organic solvent that can melt the polyimide resin, water and an ionic compound that has a polarity opposite to that of the ionic group is electrodeposited on at least part of the insulating resin layer which is dried and heated.