To improve alignment accuracy in manufacturing (especially, lamination of an insulation layer and a conductive layer) of a wiring board.
A wiring board manufacturing method comprises: forming on a substrate 100 (lower layer insulation layer) on which a conductor layer 100a (including a conductor pattern), a reference mark 2004a which pierces a metal foil 1011 and an insulation layer 101 which has the metal foil 1011 on a top face to reach an insulation layer 102 in a region (X-Y plane) where the conductor layer 100a is not formed; and recognizing the reference mark 2004a as a part where a reflection quality of an electromagnetic wave is less than that of the surrounding part and performing pattern plating with reference to the reference mark 2004a to form the conductor layer composed of the metal foil 1011 and plating (electroless plating film 1013, electrolyte plating film 1017) on the insulation layer 101.
SATO HIROYUKI
ITO YUKI
Koji Yashima
Naoki Yamaguchi
Takehiko Ishido
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