Title:
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3789803
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring board where a plurality of through hole conductors are not short-circuited and wiring layers on the surface and the rear face of a board can correctly be connected and to provide the manufacturing method.
SOLUTION: The wiring board 1 has the board 2 having the surface 4 and the rear face 5, a plurality of through holes 6a, 6b and 6c passing through the surface 4 and the rear face 5 of the board 2 and through hole conductors 8a, 8b and 8c formed along the inner walls. The through hole 6a positioned in an area 29a corresponding to an IC chip 29 that is additionally mounted has a vertical or comparatively small inclination θ between the surface 4 and the rear face 5 of the board 2, and the through holes 6b and 6c positioned out of the area 29a have comparatively large inclinations θ between the surface 4 and the rear face 5 of the board 2. The adjacent through holes 6b and 6c are inclined in almost same directions.
Inventors:
Shinya Miyamoto
Hirano Kun
Hirano Kun
Application Number:
JP2001331991A
Publication Date:
June 28, 2006
Filing Date:
October 30, 2001
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K1/11; H05K3/46; H05K3/00; H05K3/40; (IPC1-7): H05K1/11; H05K3/00; H05K3/40; H05K3/46
Domestic Patent References:
| JP8330469A | ||||
| JP10290059A | ||||
| JP2000244129A |
Attorney, Agent or Firm:
Suzuki Manabu
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