Title:
配線基板の製造方法
Document Type and Number:
Japanese Patent JP7233320
Kind Code:
B2
Abstract:
A method of manufacturing a wiring board, includes forming an interconnect layer on a first insulating layer, roughening a surface of the interconnect layer, not in contact with the first insulating layer, to form concavo-convex portions, forming a bond enhancing film on the concavo-convex portions, partially removing the bond enhancing film, using an acid solution, and forming a second insulating layer on the first insulating layer, to cover the interconnect layer.
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Inventors:
Tomoyuki Shimodaira
Kondo Human Resources
Kondo Human Resources
Application Number:
JP2019118956A
Publication Date:
March 06, 2023
Filing Date:
June 26, 2019
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/38; B32B15/08
Domestic Patent References:
| JP2004343004A | ||||
| JP2013119240A | ||||
| JP2003298230A | ||||
| JP2011228632A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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