To provide a highly reliable wiring board where the possibility that wiring breaks is reduced even if a thermal stress occurs between an insulating resin layer and the ceramic wiring board.

A plurality of the insulating resin layers 2 and a plurality of wiring layers 3 are alternately laminated on the upper face of the ceramic wiring board 1. The wiring layers 3 and 3 positioned above and below the insulating resin layer 2 are connected by via conductors 4. A plurality of the via conductors 4 formed in the lowermost insulating resin layer 2 and ends of a plurality of inner wiring 5 which are led out from inside the ceramic wiring board 1 to the upper face are electrically connected. Recesses 9 are formed on the upper face of the ceramic wiring board 1 so that they surround connection parts of the via conductors 4 and the ends of the inner wiring 5. The insulating resin 2a from the periphery of the connection part to the recess 9 enters the recess 9 in the wiring board. Since the insulating resin 2a at the periphery of the connection part is fixed by the recess 9 and is difficult to be deformed, the possibility that the connection part breaks is reduced, and therefore the highly reliable wiring board is provided.