Title:
貫通配線を有する配線基板とその作製方法
Document Type and Number:
Japanese Patent JP7020009
Kind Code:
B2
Abstract:
To provide an interposer mounting a passive device such as a capacitive element and a manufacturing method thereof, an interposer mounting a capacitive element in which capacitance dispersion is restrained significantly and a manufacturing method thereof, and a semiconductor module using the interposer.SOLUTION: A wiring board 100 includes a substrate 102 having a through hole 104, and through wiring 110 covering the sidewall of the through hole, and the first surface of the substrate and the second surface located on the opposite side to the first surface continuously. Thickness of the through wiring on the first surface is smaller than the thickness of the through wiring on the second surface. Surface roughness of the through wiring on the first surface of the substrate may be smaller than the surface roughness of the through wiring on the second surface. Furthermore, the ratio of the minimum thickness to the maximum thickness of the through wiring on the first surface may be smaller than the ratio of the minimum thickness to the maximum thickness of the through wiring on the second surface.SELECTED DRAWING: Figure 1
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Inventors:
Takano Takano
Application Number:
JP2017175915A
Publication Date:
February 16, 2022
Filing Date:
September 13, 2017
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H05K3/22; H01L23/12; H01L23/14; H01L23/15; H01L23/32; H05K1/02; H05K1/11; H05K3/40; H05K3/46; (IPC1-7): H01Q15/14; H01Q15/16
Domestic Patent References:
| JP2017112209A | ||||
| JP8078842A | ||||
| JP2001185836A |
Foreign References:
| US4568945A |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners