Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2022098059
Kind Code:
A
Abstract:
To improve the quality of a wiring board.SOLUTION: A wiring board according to an embodiment includes a first insulating layer 212, a first conductor layer 312 formed on the first insulating layer 212, a solder resist layer 17 formed on the first insulating layer 212 and the first conductor layer 312, and a second conductor layer 313 formed on the opposite side of the first conductor layer 312 via the first insulating layer 212, and has a first surface 1F and a second surface 1B which is the opposite surface of the first surface. The first conductor layer 312 includes a conductor pad 312e. The solder resist layer 17 has an opening 17a that exposes the entire surface of the conductor pad 312e. A first via 512 is connected in a region along the outer periphery of the conductor pad 312e. The first via 512 is connected to the conductor pattern 313p of the second conductor layer 313 through the first insulating layer 212.SELECTED DRAWING: Figure 1
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Inventors:
TERAUCHI IKUYA
SAKAI SHUNSUKE
SAKAI SHUNSUKE
Application Number:
JP2020211381A
Publication Date:
July 01, 2022
Filing Date:
December 21, 2020
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H05K3/28; H05K3/34
Attorney, Agent or Firm:
Asahina Patent Office