Title:
WIRING BOARD
Document Type and Number:
Japanese Patent JP2023061763
Kind Code:
A
Abstract:
To facilitate coupling between an optical waveguide in a wiring board and an optical component, and improve optical coupling efficiency.SOLUTION: A wiring board 100 of an embodiment comprises: an electric wiring part 200 including an insulation layer 21 and a conductor layer 11; and an optical wiring part 300 including an optical waveguide 5 and being placed on a surface 203 of the electric wiring part 200. The optical waveguide 5 includes a core portion 51 transmitting light and a cladding portion 52 surrounding the core portion 51, and has an end face 50 passing the light transmitted through the core portion 51. The end face 50 of the optical waveguide 5 is positioned at an outside of the electric wiring part 200 in a plane view.SELECTED DRAWING: Figure 1
Inventors:
KUNIEDA MASATOSHI
Application Number:
JP2021171884A
Publication Date:
May 02, 2023
Filing Date:
October 20, 2021
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
G02B6/122
Attorney, Agent or Firm:
Patent Attorney Corporation Asahina Patent Office