Title:
配線基板および電子装置
Document Type and Number:
Japanese Patent JP6075606
Kind Code:
B2
Inventors:
Kamase Yuji
Application Number:
JP2012212555A
Publication Date:
February 08, 2017
Filing Date:
September 26, 2012
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/09; H05K3/24
Domestic Patent References:
| JP2001144393A | ||||
| JP2005268515A | ||||
| JP2001068828A | ||||
| JP2002508453A | ||||
| JP2008263169A |
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