To provide a wiring circuit board which has an insulating resin layer and a wiring conductor firmly bonded to each other and has superior connection reliability, among wiring conductors in a via hole with high wiring density and less warpage or deformation, and to provide a method of manufacturing the wiring circuit board.

The wiring circuit board comprises a lower insulating resin layer and a lower wiring conductor, an upper insulating resin layer laminated on the lower insulating resin layer and the lower wiring conductor, while having a via hole 9 reaching the lower wiring conductor, and an upper wiring conductor as a metal-plated layer formed so as to cover from the lower wiring conductor within the via hole 9 to the upper insulating resin layer. The metal-plated layer includes a first metal-plated layer 5A, formed so as to fill a lower part in the interior of the via hole 9 and a second metal-plated layer 5B formed so as to cover from the first metal-plated layer 5A to the upper insulating resin layer.