Wiring circuit board

Japanese Patent JP6027819

B2

A wired circuit board includes a first insulating layer, a conductive pattern formed on its surface at one side in a thickness direction, and a second insulating layer formed on the surface of the first insulating layer at the one side in the thickness direction so as to cover the conductive pattern. An outer end surface of the first insulating layer in a perpendicular direction to the thickness direction is formed to be inclined outwardly gradually from the one side toward the other side in the thickness direction. An outer end surface of the second insulating layer in the perpendicular direction has an end edge at the other side in the thickness direction which is located between both end edges of the outer end surface of the first insulating layer in the perpendicular direction which are located at the one side and the other side in the thickness direction.

JP7188874	Three-stage actuation disk drive suspension with pseudo-structure integrally formed on the trace gimbal
JP2006302452	HEAD, HEAD SUSPENSION ASSEMBLY, AND DISK DEVICE PROVIDED WITH THE SAME

Atsushi Ishii
Takatoshi Sakakura

JP2012181845A

November 16, 2016

August 20, 2012

Click for automatic bibliography generation  

NITTO DENKO CORPORATION

G11B5/60; G11B21/21; H05K1/02

JP57076891A
JP2001325702A
JP3115906U
JP2012014756A

Hiroyuki Okamoto
Shinichi Uda

Previous Patent: Photoluminescent sealing material

Next Patent: ENTRANCE AND EXIT CONTROLLING SYSTEM OF BODY UTILIZING LENGTH AND WEIGHT OF BODY