Title:
WIRING FOR ELECTRONIC CIRCUIT
Document Type and Number:
Japanese Patent JP3272028
Kind Code:
B2
Abstract:
PURPOSE: To reduce a parasitic capacitance while maintaining electrical connection by removing an inside of one conductor film in advance when irradiating laser to conductor films which are arranged in superposition.
CONSTITUTION: A conductor film 201, an insulation film 204, a conductor film 202 whose inside of a laser beam irradiation part is removed and a passivation film 205 are formed on a substrate 203. Liquid crystal is sealed on the passivation film 205 viewed from the substrate 203. When a laser beam is applied from a direction E, the conductor film 210 absorbs the energy, is heated rapidly and liquefied or gasified to expand its volume. As a result, the insulation film 204 and the passivation film 205 are broken through, a liquid layer of the conductor film 201 adheres to a periphery of a hole made by the laser irradiation and an electrical contact with the conductor film 202 is realized. Since the area of superposition of a laser contact part is reduced, it is possible to restrain an element from deteriorating by reducing the parasitic capacitance and to restrain change of element characteristic before and after repair.
Inventors:
Yutaka Nakai
Application Number:
JP11943092A
Publication Date:
April 08, 2002
Filing Date:
May 13, 1992
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G02F1/1343; G02F1/1362; H01L21/768; H01L29/78; H01L29/786; H01S3/00; (IPC1-7): H01L21/768; G02F1/1343; H01S3/00
Domestic Patent References:
| JP5844744A | ||||
| JP439629A |
Attorney, Agent or Firm:
Hideaki Togawa