Title:
WIRING MEMBER AND LEAD FRAME COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP3538290
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To cope with the multi-pins and the narrower pitch of the input/output terminals of a semiconductor element and to cope with miniaturization and cost reduction of a semiconductor device, by forming an electrode part and a wiring part with a plate-like conductor, while making the thickness of the wiring part equal to a half of, or less than, the electrode part.
SOLUTION: A first electrode part 4 connected electrically to an electrode formed on the surface of a semiconductor element, a second electrode part 5 connected electrically to an electrode formed in an external circuit, and a wiring part 2 which combines the first electrode part 4 to the second electrode part 5, are all formed of a plate-like conductor 1. The wiring part 2 is formed into such thickness equal to one half of, or less than, the first electrode part 4 or the second electrode part 5. On both surfaces of the conductive metal plate 1, for example, an etching mask 3 comprising a specified pattern is formed, then etching is performed from both surfaces at the same time. When the conductive metal plate 1 is partially etched and specified etching end parts A and B are obtained, etching is ended, thus lead frame is formed.
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Inventors:
Takahashi, Ryoji
Application Number:
JP231097A
Publication Date:
June 14, 2004
Filing Date:
January 09, 1997
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L23/12; H01L23/495; H01L23/50; (IPC1-7): H01L23/50; H01L23/12
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