Title:
WIRING STRUCTURE TO ELECTRONIC MODULE UNIT
Document Type and Number:
Japanese Patent JP2002002415
Kind Code:
A
Abstract:
To provide a wiring structure to an electronic module unit with versatility capable of easily performing wiring when option equipment is added to the electronic module unit to be mounted on an instrument panel and is externally connected.
A connector 12 for option connected with a circuit board 16 is arranged on a lower surface 10c of the electronic module unit 10. A wire harness 3 for option to be connected with the option equipment can be connected with the connector 12.
Inventors:
OKAMURA NORITOMO
HIRAI HIROKI
SAKAI SHIGEKI
SAKAI YOSHITO
HIRAI HIROKI
SAKAI SHIGEKI
SAKAI YOSHITO
Application Number:
JP2000181776A
Publication Date:
January 09, 2002
Filing Date:
June 16, 2000
Export Citation:
Assignee:
AUTO NETWORK GIJUTSU KENKYUSHO
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO WIRING SYSTEMS
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B60R16/02; B60R11/02; H01R24/00; H02G3/16; H02G3/38; H01R107/00; (IPC1-7): B60R16/02; B60R11/02; H01R24/00; H02G3/16; H02G3/38
Attorney, Agent or Firm:
Etsushi Kotani (2 outside)
Previous Patent: ELECTRIC CONNECTION STRUCTURE FOR VEHICLE AND METHOD THEREFOR
Next Patent: OPERATION SYSTEM FOR ON-VEHICLE EQUIPMENT
Next Patent: OPERATION SYSTEM FOR ON-VEHICLE EQUIPMENT