To provide a wiring structure for easily changing wiring by using an ink jet method at the time of performing the change of wiring due to the design mistake of wiring to a circuit board including electronic elements.
First conductive liquid materials 11a are discharged and formed by a drop discharging device 1, and then first conductive wiring 23 as a good quality conductive film is obtained after thermal and/or optical treatment. A wiring connection part 23a as a portion of the first conductive wiring 23 is electrically connected to a conductor pattern 21b as a portion of the wiring of a circuit board 10A. Also, a portion of a conductor pattern 21j as the other wiring of the circuit board 10A, and a wiring connection 23b as the other portion of the first conductive wiring 23, are electrically connected.
Fujitsuna Hideyoshi
Osamu Suzawa