Title:
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3398316
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a wiring substrate, wherein unwanted radiation from it is suppressed, harmonics noise is removed effectively, noise is hardly released to an external electric circuit board, and a mounted semiconductor element is driven normally and stably at high speed, for a wiring substrate in which an insulating base body wherein inorganic insulating powder is combined with thermosetting resin is coated with a wiring conductor in which metal powder is combined with the thermosetting resin.
SOLUTION: An insulating base body 1 comprising inorganic insulating powder and ferromagnetic powder of 60-95 wt.% and thermosetting resin of 5-40 wt.% is coated with a wiring conductor 2 where metal powder is combined with thermosetting resin. The ferromagnetic powder in the insulating base body 1 absorbs unwanted radiation from the wiring conductor 2 for suppressed harmonics noise, thus a mounted semiconductor element is driven normally and stably at high speed.
Inventors:
Fujito Nakagawa
Application Number:
JP32148697A
Publication Date:
April 21, 2003
Filing Date:
November 21, 1997
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K1/03; H01L23/14; H05K1/09; H05K3/12; H05K9/00; (IPC1-7): H05K1/03; H01L23/14; H05K3/12; H05K9/00
Domestic Patent References:
| JP9232472A | ||||
| JP9181413A | ||||
| JP9181408A | ||||
| JP38388A | ||||
| JP7335440A |