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Patent Searching and Data


Title:
WOODY MOLDED BOARD
Document Type and Number:
Japanese Patent JPH10286808
Kind Code:
A
Abstract:

To improve the dimensional accuracy, appearance and durability by laminating a fibrous mat mixed with heat-setting resin powder to the back face of a wood veneer impregnated with a heat-setting resin and integrally binding together both wood veneer and fibrous mat by self-adhesion through the heat-setting resin simultaneously with the press-molding of the laminate by a press while it is hot.

A single, piece or plural pieces of wood veneer 1, 1 obtained by slicing broad-leaved trees such as Japanese oak beech impregnated previously with a heat-setting resin made up of phenol or epoxy resins, are used. In addition, a pliable, easily deformable and highly rigid fibrous mat 2 which is formed of a mixed fiber of woody fiber and hemp fiber in a mat shape and internally has heat-setting resin powder of phenol or epoxy resin, is laminated on the back face of the wood veneer 1. Further, the laminate is arranged between the top force 3a and the bottom force 3b of a mold, then is pressed using a press and the wood veneers 1, 1 and the fibrous mat 2 are bonded together by themselves into the woody molded board. This board shows high surface hardness, wear resistance, water resistance and heat resistance without joint part and has an uneven pattern formed definitely on the surface.


Inventors:
HARANO NAOYUKI
Application Number:
JP11042197A
Publication Date:
October 27, 1998
Filing Date:
April 11, 1997
Export Citation:
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Assignee:
INAX CORP
International Classes:
B27D5/00; B27N5/00; B32B21/08; (IPC1-7): B27N5/00; B27D5/00; B32B21/08
Attorney, Agent or Firm:
Yoshihisa Shimizu