WORKING METHOD OF SEMICONDUCTOR WAFER

Title:

WORKING METHOD OF SEMICONDUCTOR WAFER

Document Type and Number:

Japanese Patent JP2004119780

Kind Code:

A

Abstract:

To provide a working method of a semiconductor wafer using an adhesive sheet which is excellent in travelling property in an automatic sticking machine of an adhesive sheet and shows good adhesion to the semiconductor wafer in working.

The working method of a semiconductor wafer comprises a process for performing a working process (a) for the semiconductor wafer with an ultraviolet reactive adhesive sheet, wherein an ultraviolet reactive adhesive layer is provided on a base film, stuck to the front or the rear of the semiconductor wafer. Furthermore, after the adhesive sheet is stuck to the semiconductor wafer, a heating process (b) and then an ultraviolet irradiation process (c) are carried out and the working process (a) is carried out with adhesion of the adhesive sheet to the semiconductor wafer raised than that in sticking.

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Inventors:

HASHIMOTO KOICHI

Application Number:

JP2002282521A

Publication Date:

April 15, 2004

Filing Date:

September 27, 2002

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

H01L21/683; H01L21/301; H01L21/304; H01L21/68; (IPC1-7): H01L21/68; H01L21/301; H01L21/304

Attorney, Agent or Firm:

Takao Suzuki
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi

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