Title:
An added type silicone resin constituent and a closure agent for optical semiconductor devices
Document Type and Number:
Japanese Patent JP6211251
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a curable silicone resin composition which has excellent adhesion to a poorly-adhesive substrate such as a polyphthalamide resin, is excellent in sulfur gas barrier properties, has excellent durability under high temperature and high humidity, and is useful as an adhesive, a sealing agent, a sealant and the like.SOLUTION: A reactant (d) obtained by reacting a (meth)acryloyl group-containing silane coupling agent (d1), an alicyclic epoxy group-containing silane coupling agent (d2) and a vinyl group-containing silane coupling agent (d3) is added to an addition type silicone resin composition.
Inventors:
Sam Hui
Application Number:
JP2012140229A
Publication Date:
October 11, 2017
Filing Date:
June 21, 2012
Export Citation:
Assignee:
Aica Kogyo Co., Ltd.
International Classes:
C08L83/05; C08L83/07; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP2012007126A | ||||
| JP2014005326A |