Title:
An adhesion method and a manufacturing method of a structure
Document Type and Number:
Japanese Patent JP5917613
Kind Code:
B2
Abstract:
The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).
Inventors:
Shota Akita
Yoshino Gento
Youhei Kasai
Akira Sakamoto
Yoshino Gento
Youhei Kasai
Akira Sakamoto
Application Number:
JP2014136226A
Publication Date:
May 18, 2016
Filing Date:
July 01, 2014
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
C09J5/02; B23K26/36; B23K26/40; B32B7/12; B32B15/08; C09J201/00
Domestic Patent References:
| JP2001284676A | ||||
| JP2002084159A | ||||
| JP2014012284A | ||||
| JP2007167936A | ||||
| JP2006316290A | ||||
| JP64073750A | ||||
| JP2000357936A |
Attorney, Agent or Firm:
Harakenzo world patent & trademark